Engineers specifying resistor arrays rely on precise electrical and mechanical data to prevent field failures. This comprehensive guide decodes critical specifications, selection criteria, and thermal management for embedded, analog, and industrial designs. ? What is a 10k Resistor Network in a 10-Pin SIP? A 10-pin Single In-Line Package (SIP) integrates multiple resistors into a compact, space-saving footprint. Typical per-resistor power ratings are around 1/8 W (≈125 mW), with tolerances ranging from ±1% to ±5%, and temperature coefficients between ±50 and ±250 ppm/°C. Form Factor & Pinout A 10-pin SIP packages ten individual resistors with a 2.54 mm (0.1") pitch. The overall length is typically ≲25.4 mm. We recommend a through-hole footprint with 0.8–1.0 mm plated holes and 2.8–3.2 mm pad lengths. [1 2 3 4 5 6 7 8 9 10] | | | | | | | | | | (Top View Pin Row) Internal Configurations Isolated: 10 independent elements. Bussed: 9 resistors tied to a common pin. Ladder: Used for R-2R DAC/ADC networks. Series: Connected in a single string for termination. Key Electrical Performance Metrics Power Rating (Per Element) 125 mW - 250 mW Temperature Coefficient (Tempco) ±50 – ±250 ppm/°C Pro Tip: Calculate allowable current using I = sqrt(P/R). For 125 mW into 10 kΩ, I_max ≈ 3.5 mA. Ensure derating for ambient temperatures above 70°C. Reliability & Stability Drift over time depends on the resistance film technology. Thick-film components are cost-effective for non-critical pull-ups, while thin-film variants offer superior long-term stability and lower aging (often expressed in ppm/year) for precision ADC dividers. Environmental Performance Standard operating ranges span −55°C to +125°C. Optional conformal coatings protect against moisture but may impact convective cooling. For industrial or MIL-spec applications, prioritize high insulation resistance (MΩ or GΩ range). Selection Guide: Technical Specifications Specification Field Typical Range Design Notes Nominal Resistance 10 kΩ Standard base value for most SIP arrays. Tolerance ±1% / ±2% / ±5% Choose ±1% for precision measurement dividers. Working Voltage 50V – 150V Maximum continuous voltage per resistor element. Short-time Overload 2.5x Rated Voltage Verified duration for surge conditions. Frequently Asked Questions How do I verify 10-pin SIP footprint dimensions before PCB release? + Always cross-check the vendor's mechanical drawing against your CAD library. Confirm 2.54 mm pin pitch, 0.8–1.0 mm hole diameters, and seating height. We suggest a 1:1 paper printout to verify physical clearance for surrounding components. Which tempco should I specify for precision divider networks? + Specify the lowest practical temperature coefficient—ideally ≤100 ppm/°C—paired with ±1% tolerance. Thin-film technology is preferred here to reduce drift across the operating temperature range and ensure long-term matching. What bench tests are essential for incoming 10-pin SIP arrays? + Perform an initial resistance check at 25°C for all elements, an insulation resistance (IR) test, and a visual inspection of the leads and coating finish. If the application is high-voltage, a hi-pot test may also be required. SIP Executive Summary Topology Priority Match internal routing (isolated, bussed, ladder) to your function to simplify layout and reduce trace congestion. Precision & Drift Use thin-film for ADC/divider accuracy; thick-film is perfectly adequate for general-purpose pull-ups and line terminations. Thermal Safety Always compute power margins and apply 50% derating in high-ambient environments to maximize component lifespan.

The datasheet and bench measurements show the 4310R-101-104 is a 9-resistor, 10-pin bussed SIP resistor network with 100 kΩ nominal elements, 2% tolerance, ±100 ppm/°C TCR and approximately 1.25 W total dissipation — well suited for compact pull‑up/pull‑down arrays and matched bias networks. This article provides complete specs, reproducible test methods, representative measured results and practical design/substitution guidance for engineering validation. Product background & core specs (background introduction) Key electrical specifications Nominal resistance: 100 kΩ per element; tolerance: 2% (standard). Elements: 9 resistors in a bussed SIP, total pins: 10. TCR is specified at ±100 ppm/°C (thick‑film specification, measured over a defined temperature interval). Power: ≤200 mW per element (derate by temperature) with total network dissipation ≈1.25 W. Operating temperature range typically −55°C to +125°C. Use the spec table below for compact reference and verify specific lot data before production. Parameter Value Configuration 9× resistors, bussed SIP (10 pins) Resistance (nominal) 100 kΩ Tolerance ±2% TCR ±100 ppm/°C Power per element ≤200 mW Total dissipation ≈1.25 W Operating temp −55 °C to +125 °C Packaging Molded SIP, bussed; RoHS compliant Mechanical & pinout essentials Pin numbering: 10 pins, center common (buss) plus 9 individual resistor pins. Typical body length for through‑hole SIPs is compact — check the datasheet for exact footprint and tolerances. Handling: through‑hole leads accept standard solder fillet; avoid excessive reflow heat during wave soldering. Below is a simple ASCII pinout illustrating the buss/common arrangement for PCB reference. Pin1 Pin2 Pin3 Pin4 Pin5 o-----o-----o-----o-----o Bench test methodology & measured electrical performance (data analysis) Test setup & measurement procedures Recommended equipment: 4½‑digit DMM, LCR meter, thermal chamber, stable DC power supply, data logger and forced‑air for thermal tests. Measure at three ambient points (e.g., 25°C, 85°C, −40°C) with 5–10 minute soak per point. For TCR use resistance vs temperature sweep; for power derating apply incremental voltage/current per element while monitoring temperature rise and resistance change. Use n≥10 units for basic statistical confidence. Measured results & interpretation Report mean resistance, standard deviation, min/max spread and percent change vs temperature and power. Example sample table (representative): Metric Measured Mean R (25°C) 100.2 kΩ Std dev (n=10) 0.9 kΩ (≈0.9%) TCR (slope) ≈+95 ppm/°C ΔR @ 200 mW elem +0.6% after 30 s Visualized metrics (relative) Mean R (100.2 kΩ) Std dev (0.9 kΩ ≈0.9%) TCR (~+95 ppm/°C) ΔR @ 200 mW (+0.6%) Interpretation: ratio stability across bussed elements is often better than absolute drift; watch for open elements and thermal interaction when neighboring resistors dissipate power. Plot resistance vs temperature and % change vs applied power for clear pass/fail criteria. Application & design considerations (method guide) Where to use this resistor network Common uses: pull‑ups/pull‑downs for multi‑IO banks, matched arrays for reference and bias networks, and passive resistor banks for logic lines. Advantages over discrete parts include board space savings, matched thermal behavior and reduced assembly time. Example circuits: (1) MCU IO bank pull‑up array, (2) 8‑channel divider feeding multi‑input comparator with a shared common node. Sizing, derating and PCB layout tips Calculate element power: P = V²/R per resistor. Derate power linearly above 70°C according to datasheet to remain below 200 mW per element. Maintain PCB copper around leads for heat spreading, use thermal vias sparingly under SIP body, and leave clearance between high‑power adjacent resistors to reduce thermal coupling. Checklist: verify per‑element power, copper pour, via placement, and solder fillet size. Substitution & compatibility checklist (case study style) When to choose a substitute or upgrade Consider substitution if you need tighter tolerance ( Spec matching checklist for safe substitution Printable checklist: match resistance value per element, tolerance, TCR, number of resistors/pinout, power per element and total, package footprint and environmental ratings (temp/humidity). Verify mechanical fit, derating curves and expected ratio stability before committing to a cross. Resistance and tolerance match TCR and derating behavior Pinout and footprint compatibility Power per element and total dissipation Environmental and soldering ratings Practical test checklist & sample lab report (action recommendations) Step-by-step test checklist 1) Visual and continuity inspection; 2) Initial cold resistance at 25°C for all elements; 3) TCR sweep (−40 → +85°C or wider) with soak and record; 4) Power/thermal test: apply stepwise power to single element up to derated limit; 5) Post‑stress resistance check and humidity/aging if required. Include ESD and safety precautions when handling and powering networks. Sample lab report template & recommended data presentation Report sections: Summary, Equipment, Test Conditions, Raw Data, Plots (resistance histogram, R vs T, %Δ vs power), Pass/Fail and Recommendations. Example conclusion language: “Units conform to datasheet specs for resistance, TCR and power derating under tested conditions; no open elements or unacceptable drift observed.” Key summary The 4310R-101-104 is a compact 9‑resistor, 10‑pin bussed SIP resistor network with 100 kΩ elements and 2% tolerance; validate per‑element power and TCR during qualification. Bench tests should include resistance distribution, TCR sweep and power derating with n≥10 units; present results as mean/std, R vs T and % change vs power plots. Use the substitution checklist to match resistance, tolerance, TCR, pinout and power; pay attention to thermal coupling and PCB copper for reliable operation. Common questions How do I verify 4310R-101-104 TCR in my lab? Use a thermal chamber to measure resistance at multiple temperatures (for example −40°C, 25°C, +85°C). Record steady‑state resistance after a 5–10 minute soak at each point, plot R vs T and compute ppm/°C from the slope. Ensure low measurement current to avoid self‑heating during TCR tests. What are typical failure modes for this resistor network? Common failures include open resistor elements from handling stress, drift beyond tolerance after thermal stress, and excessive resistance change due to moisture ingress in marginally sealed packages. Verify soldering profiles and avoid localized overheating during assembly to reduce risk. Can I use the 4310R-101-104 for high‑voltage applications? These thick‑film bussed SIPs are optimized for low‑voltage logic and bias networks. For high‑voltage use, check datasheet maximum working voltage and consider larger pitch, higher voltage rated arrays or discrete resistors with appropriate creepage and clearance to meet safety requirements. Responsive note: parent container width is 1340px with max-width:100% to ensure good reading on both desktop and mobile. Tables and images use full width for readability and SEO-friendly structure.

The 4310R-101-472 is a 9-element, 10-pin bussed SIP resistor network specified as 4.7 kΩ per element with ±2% tolerance, roughly 200 mW power per element and a TCR of 100 ppm/°C across a typical operating range near −55 °C to +125 °C. This data-driven snapshot frames the part for PCB designers evaluating board-level power, thermal and tolerance impacts; the article breaks these specs down and delivers practical selection and test guidance. This resistor network form factor reduces BOM and board area while providing a common-node pull-up/pull-down array. The following sections cover identity and footprint, full electrical specifics, thermal behavior, design-in recipes and a procurement checklist so engineers can validate lots before production. Quick background & what this part is (background introduction) Core identity and typical package A 9-element bussed SIP resistor network ties one end of nine identical resistors to a single common pin, with the other ends routed to individual pins, yielding ten total pins on a standard SIP. Typical mounting is low-profile through-hole for robust lead retention; pitch is standard 2.54 mm (0.100") with a compact body height suited to constrained PCBs. Designers choose a bussed resistor network for consistent pull-up/pull-down behavior and simplified routing compared to discrete parts. Short spec summary table Quick facts for fast reference; each line is a headline spec for scan reading. Resistance value 4.7 kΩ per element Tolerance ±2% Power per element ~200 mW (continuous rating) TCR 100 ppm/°C Temperature range ≈ −55 °C to +125 °C Pins / resistors 10 pins / 9 resistors (bussed) Technology Thick-film Spec visual summary Power per element — 200 mW (relative) Small (mW) 200 mW TCR — 100 ppm/°C (smaller is better) 100 ppm/°C ~1.25% over −40→+85 °C Operating temperature range ≈ −55 °C to +125 °C Full electrical specification breakdown (data analysis) Resistance value, tolerance and arrangement The nominal 4.7 kΩ value with ±2% tolerance gives a worst-case range of approximately 4,606 Ω to 4,794 Ω per element (4,700 × (1 ± 0.02)). In bussed arrays the common node ties one end of each resistor together, making them ideal for uniform pull-ups or pull-downs on parallel inputs. Example: a microcontroller input expecting a threshold at 1.4 V with a 10 kΩ pull-up network will see predictable biasing when each element remains within the stated tolerance band. Voltage, power and derating behavior With P ≈ 0.2 W per element, the nominal maximum steady RMS voltage across a 4.7 kΩ element is Vmax ≈ sqrt(P×R) ≈ sqrt(0.2×4,700) ≈ 30.7 V (use Ractual for precise per-lot numbers). Continuous vs peak: continuous rating is conservative; short-duration pulses may exceed it if thermal time constants are respected. For elevated ambient conditions apply linear or vendor-supplied derating—example guideline: limit element dissipation to 60–80% of nameplate at +85 °C. [confirm max element voltage per datasheet] Thermal performance, TCR and reliability (data analysis) Temperature coefficient of resistance (TCR) and stability Key specs to watch: TCR = 100 ppm/°C means a fractional change of 0.0001 per °C. Over a −40 °C to +85 °C span (ΔT = 125 °C) expect about a 1.25% change in resistance, i.e., ~59 Ω on a 4.7 kΩ element. For precision ADC reference dividers or matched networks this shift is material; consider lower-TCR alternatives or temperature compensation when measurement error budgets are tight. Thick-film technology also exhibits modest long-term drift—specify lot stability tests for critical runs. Thermal limits, derating and expected lifetime Rated operating range near −55 °C to +125 °C implies the package tolerates wide ambient swings, but internal element temperature rises under dissipation reduce margin. Thermal coupling among elements concentrates heat inside the package, lowering per-element allowable power vs isolated resistors. Reliability checks should include thermal cycling and humidity tests; incoming lot tests should exercise power-soak at elevated ambient to screen weak units and qualify lifetime under expected board copper area and airflow conditions. Design-in guide — footprint, assembly and test procedures (method guide) PCB footprint, mechanical placement and soldering Use a 2.54 mm pin pitch footprint with pad drills sized for through-hole leads; recommended annular pad diameter ~1.2–1.5 mm and solder fillet clearance on both sides. Keep a small keepout around the body for thermal relief and mark orientation on silkscreen at the common pin. Through-hole leads suit wave or hand solder; allow mechanical strain relief in silkscreen or pick-and-place tooling and avoid tight traces under the body that impede heat dissipation. Electrical test procedures and validation on the bench Test recipe: measure each element at room temperature with a precision DMM, verify within ±2%; check bus continuity by measuring resistance between common pin and each node (expected ~Rvalue). Power-soak test: apply 0.2 W to a single element while monitoring temperature rise; confirm no drift beyond tolerance after soak. For derating validation, run thermal-chamber sweeps at expected ambient extremes and verify resistance vs temperature. Pass/fail: R within tolerance at 25 °C and no open/short after power soak. Typical applications, selection checklist & alternatives (case + action) Typical use-cases and real-world examples Common applications include input-line pull-ups/pull-downs for keyed buses, resistor banks for LED arrays where identical values simplify drive, and mapping resistors for selector networks. A bussed 9-element 4.7 kΩ, ±2% device is a fit when identical biasing is required across many lines and board area or placement simplicity matters. Caveats: precision thresholds or higher per-channel power call for discrete or higher-spec arrays. Selection and procurement checklist before production Checklist: confirm nominal value & ±2% tolerance, validate power per element and a derating plan for ambient/PCB conditions, verify TCR and operating temperature range, confirm package pinout and footprint compatibility, define lot testing (IR, power-soak, thermal cycling), ensure RoHS/lead-free requirements and qualify alternatives for supply risk. Incorporate acceptance criteria into incoming inspection procedures to avoid field failures. Summary The 4310R-101-472 provides nine 4.7 kΩ bussed resistors in a 10-pin SIP package, suitable for compact pull-up/pull-down arrays and reducing discrete placement complexity. Evaluate power derating carefully: nominal 200 mW per element yields ~30.7 V theoretical across a 4.7 kΩ element, but ambient and package coupling reduce continuous allowance. TCR = 100 ppm/°C implies ~1.25% change across a −40 to +85 °C span; assess impact on ADC/reference circuits and consider lower-TCR parts for precision needs. Use the provided PCB, soldering and test recipes—DMM checks, power-soak and thermal-chamber sweeps—to qualify incoming lots before production. FAQ How does tolerance and TCR affect circuit thresholds for the 4310R-101-472? Tolerance ±2% sets the static resistance band; combined with a 100 ppm/°C TCR, temperature swings introduce additional percent-level shifts. For threshold-sensitive inputs, calculate worst-case using Rmin/Rmax plus TCR-induced delta across operating ΔT and confirm thresholds remain valid under those extremes. What voltage can be safely applied across one element? Use Vmax ≈ sqrt(P×R) with P as the continuous power rating. For 0.2 W and 4.7 kΩ, Vmax ≈ 30.7 V; verify with the datasheet and apply derating for elevated ambient. If the datasheet does not list maximum element voltage explicitly, include “[confirm max element voltage per datasheet]” in your procurement checks. What incoming tests should manufacturing perform on these resistor networks? Minimum incoming tests: room-temperature resistance sweep of all nine elements (±2% pass), bus continuity check, and sample power-soak/thermal cycling to validate derating assumptions. Add humidity and mechanical stress tests for harsher environments and document acceptance criteria in the purchase order. Document: 4310R-101-472 — technical summary and design guidance. Use this as a checklist when evaluating bussed SIP resistor networks during PCB design and procurement.

The L101S471LF datasheet consolidates the essential parameters designers need when choosing a 10‑pin resistor network: nine 470 Ω resistors, ±2% tolerance, ~100 ppm/°C temperature coefficient, bussed configuration, and ~0.125 W power per resistor. These numbers directly affect noise, bias currents, thermal derating and placement decisions on compact PCBs, so a single-reference datasheet speeds accurate design and review. This article covers electrical specs, mechanical dimensions, a clear pinout, example wiring patterns, PCB/layout and test tips aimed at hardware engineers and PCB designers. It presents quick calculations and checklist items so readers can convert the L101S471LF data into safe operating margins and practical layouts within a concise technical summary. 1 — What the L101S471LF Is (Background) Key specs at a glance Resistor value: 470 Ω nominal (each of nine resistors) Tolerance: ±2% (specification block in datasheet electrical table) Configuration: 10‑pin SIP, bussed common pin, nine resistors Power per resistor: ~0.125 W typical (lookup in power rating section) Temperature coefficient: 100 ppm/°C (listed in environmental/temperature table) These entries typically appear in the datasheet overview, electrical characteristics table and mechanical drawing; confirming each location avoids selection errors during BOM review. Typical applications The L101S471LF is commonly used for grouped pull‑ups or pull‑downs on MCU port banks, simple signal termination, and sensor interface bias networks. Long‑tail search targets include phrases like “resistor network for MCU pull‑ups” and “resistor array 10‑pin SIP for I/O bias,” reflecting its typical role in embedded systems and compact analog grouping. 2 — Complete Electrical Specifications (Data & How to Use Them) Resistance, tolerance and temperature coefficient Nominal resistance is 470 Ω; ±2% tolerance means actual value = 470 Ω ±9.4 Ω. With 100 ppm/°C, the drift from −40 to +85 °C (a 125 °C span) is 470 Ω × 100×10⁻⁶ ×125 ≈ 5.9 Ω, so worst‑case over temperature adds roughly 1.25% to the base tolerance. Use this to size precision circuits and set comparator thresholds. Power rating and derating guidance Each resistor is rated at ~0.125 W. For a single resistor, allowable continuous current I = sqrt(P/R) = sqrt(0.125/470) ≈ 0.0163 A (16.3 mA). On a populated PCB, derate for elevated ambient and reduced airflow—apply linear derating from rated temp to maximum operating temp per datasheet derating curve and avoid running resistors near their max power in parallel configurations unless thermal modelling confirms safe junction rise. 3 — Mechanical, Pinout & Thermal Details (Package & Pinout) Package dimensions and footprint guidance Key mechanical parameters to note: 10‑pin SIP body length, pin pitch (typically 2.54 mm), body height and lead length. Recommended PCB footprint items include 2.54 mm pitch holes, 0.8–1.0 mm plated through‑hole drill, and annular rings sized per board house rules. Check the datasheet drawing for exact tolerances before final artwork. Pinout diagram and pin functions Pin mapping: a 10‑pin SIP with one common (bussed) pin and nine individual resistor end pins. Textual mapping example: Pin 1 = resistor1 end A, Pins 2–10 = resistor ends B and the common (depending on manufacturer orientation). Use the label “common” for the bus pin and verify orientation notch when converting to a silk‑screened diagram. 4 — How to Read the L101S471LF Datasheet (Practical Guide) Interpreting electrical tables and tolerances Datasheet tables show typical vs maximum columns—typical values are representative, maximum are guaranteed limits. Confirm test conditions (ambient temperature, measurement circuit) printed in the table footnotes. Treat limits as the guaranteed safe spec; use typicals only for approximate modelling and margining. Finding substitution/variant info and ordering tips Variants differ by resistance value, tolerance code, or temperature coefficient suffixes. When seeking drop‑in substitutes, match package, pinout polarity (bussed vs isolated), R value, tolerance and power rating. Always confirm revision level and ordering code suffixes in the official datasheet before placing an order. 5 — Example Circuits & Wiring Patterns (Case Studies) Bussed vs. isolated resistor configurations For bussed pull‑ups tie the common pin to VCC and each resistor end to individual I/O lines; this creates uniform pull‑up resistance across lines. For isolated networks, each resistor is independent—useful for voltage dividers or matched termination. Text schematic: COMMON → VCC; R1 ←→ IO1, R2 ←→ IO2, etc. Typical use-cases: pull-ups, voltage dividers, and termination Pull‑up example: with 470 Ω to VCC (3.3 V), steady current per line = 3.3/470 ≈ 7.0 mA; ensure total bus current and power stay below derated limits. For a divider, pair 470 Ω with another resistor; check loading effects on signal integrity and place the array close to the MCU pins for best performance. 6 — Design & Test Checklist (Actionable next steps) PCB layout, thermal and Soldering best practices Checklist: verify footprint and drill sizes, include thermal relief for through‑holes, allow spacing for heat dissipation, orient part number/marking toward test probes, and use standard lead‑free solder profiles. Consider conformal coating only after thermal verification; coatings can trap heat and affect dissipation. Measurement and troubleshooting tips Testing steps: measure each resistor in‑circuit with power removed; look for expected resistance ±2% and common continuity on bus pin. Under power, verify voltages and use thermal imaging or touch testing for hot spots. Common failures include solder cracks, incorrect pin wiring and localized overheating from excessive bus current. Summary Key takeaways: the L101S471LF datasheet defines nine 470 Ω resistors in a 10‑pin SIP bussed package with ±2% tolerance, 100 ppm/°C tempco and ~0.125 W per resistor—data critical for biasing and termination. Consult the full L101S471LF datasheet for exact mechanical drawings and absolute maximum ratings before layout and procurement. Electrical fundamentals: 470 Ω, ±2% tolerance and 100 ppm/°C—use these to set precision and drift margins in circuits. Mechanical and pinout: 10‑pin SIP, 2.54 mm pitch; verify footprint drill and orientation before PCB release. Thermal & power: 0.125 W per resistor; calculate I = sqrt(P/R) and derate for board temperature and crowded layouts. 7 — FAQ What is the L101S471LF datasheet key resistance and tolerance? The L101S471LF lists nine 470 Ω resistors with a ±2% tolerance. Designers should calculate absolute tolerance: 470 Ω ±9.4 Ω, and include temperature drift from the 100 ppm/°C spec when budgeting precision across expected operating temperatures. How is the pinout arranged for the L101S471LF pinout? The 10‑pin SIP has a single common (bussed) pin and nine individual resistor ends. Orientation markers on the package define Pin 1; map Pin 1 through Pin 10 according to the datasheet drawing to place the common on the correct net when converting text mapping to a PCB silk diagram. What test steps confirm a good installation of L101S471LF? With power off, measure each resistor to confirm value within ±2% and check common continuity on the bus pin. Power the board and measure voltages under load, inspect for hot resistors, and reflow suspect joints. Thermal imaging helps identify overloaded elements or poor solder joints quickly.