SOMC160110K0GRZ399 datasheet: Full electrical report

8 February 2026 13

The SOMC160110K0GRZ399 is a 15-element resistor network engineered for precision divider and bussed applications. This comprehensive report details electrical specifications, thermal constraints, and validation procedures essential for high-reliability circuit design.

Product Overview & Key Specifications

Part-Number Meaning & Circuit Options

Point: The part code encodes element count, resistance value, tolerance, and internal topology (bussed vs. isolated).

Evidence: Typical arrays offer a bussed common plus isolated elements in a single package.

Explanation: Simplified pull-ups and common references for system design; isolated elements support independent divider channels. Always verify topology on the datasheet schematic before net assignment.

SOMC160110K0GRZ399 resistor network technical diagram
Parameter Value Design Interpretation
Nominal Resistance 10 kΩ Limits divider impedance and power draw.
Tolerance ±2% Sets the initial accuracy threshold.
TCR ~100 ppm/°C Defines resistance drift over temperature.
Power Rating ~0.08 W / Element Dissipation cap at 70°C ambient.
Operating Range −55°C to +155°C Standard industrial/automotive thermal envelope.

Detailed Electrical Specifications & Limits

Resistive Performance: Tolerance, TCR & Stability

The ±2% tolerance and 100 ppm/°C TCR determine worst-case behavior. For precise calculations, use the formula: R_at_T = R_nominal × [1 + (TCR × ΔT)].

Numeric Example: Worst-Case Analysis At +85°C (ΔT = +60°C from 25°C):
• R_drift = 10,000 × [1 + (100e−6 × 60)] = 10,060 Ω
• Worst-case High (+2%): 10,261 Ω
• Worst-case Low (-2%): 9,859 Ω

Power, Voltage and Current Limits

Max Current (I_max)
2.83 mA
Max Voltage (V_max)
28.3 V

Note: Adjacent element heating reduces effective dissipation. Refer to the derating curve for temperatures above 70°C.

Package, Pinout & Mechanical Data

PCB Footprint Recommendations

  • Provide 0.5–1 mm solder fillet clearance.
  • Maintain copper pour with thermal relief for dissipation.
  • Use thermal vias under the package for improved heat spreading.

Soldering & Reflow

  • Lead-free reflow peak: ~245°C.
  • Minimize loop area in routing for precision networks.
  • Avoid excessive mechanical shear during assembly.

Performance Testing & Validation

Bench Test Procedures: Use a 4-wire resistance measurement for absolute accuracy. Perform a stepped-load power test while monitoring temperature rise via thermocouple to verify thermal stability.

Reliability Data: Load-life stability is the critical metric. If measured drift exceeds ppm specifications, investigate soldering thermal history, PCB mechanical stress, or chemical contamination.

Application Selection Checklist

✓
Verify internal topology (Bussed vs. Isolated) matches schematic requirements.
✓
Confirm per-element power margin (P_actual / P_rated
✓
Evaluate TCR impact on ADC ratio accuracy for divider circuits.
✓
Check footprint compatibility with high-density automated placement.

Key Summary

  • • 10 kΩ ±2% Precision: TCR of 100 ppm/°C requires careful accuracy budgeting for high-temp environments.
  • • Electrical Limits: I_max ≈ 2.83 mA and V_max ≈ 28.3 V per element; apply linear derating above 70°C.
  • • Thermal Design: Use copper pours and thermal vias to ensure long-term reliability and load-life stability.

Frequently Asked Questions

What test steps verify SOMC160110K0GRZ399 resistance and matching? +
Use a calibrated 4-wire meter for absolute resistance and pairwise comparisons for matching. Apply low current (
How do I compute safe voltage and current limits? +
Compute I_max = sqrt(P_max / R) and V_max = sqrt(P_max × R). For 10 kΩ at 0.08 W, limits are ~2.83 mA and ~28.3 V. Adjust these down using the datasheet derating curve if operating in high ambient temperatures.
What if measured drift exceeds the datasheet load-life stability? +
Isolate process causes like reflow stress or board flex. If drift persists, increase design margin by choosing a tighter TCR part or redesigning the circuit to reduce per-element power dissipation and mechanical stress.

Ready for Implementation?

Retrieve the official SOMC160110K0GRZ399 datasheet PDF and verify your PCB footprint before production.

Download Technical Specs

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